The 54th International Electronic Circuits Exhibition (JPCA Show 2025) commenced on June 4, 2025, at Tokyo Big Sight, Japan. Organized by the Japan Electronics Packaging and Circuits Association (JPCA), the event serves as a pivotal platform for showcasing cutting-edge technologies and solutions in the electronic circuit and packaging sectors.
Strong Participation from Chinese Delegation
The China Printed Circuit Association (CPCA) led a delegation of nearly 30 industry professionals to the exhibition. CPCA Vice Chairman and Director of the Exhibition Steering Committee, Mr. Luo Chunfeng, represented the Chinese contingent at the opening ceremony, symbolizing the deepening cooperation between Chinese and Japanese industries.
Over 30 leading Chinese companies participated, including Fischer Technology, Han's CNC, Jinzhou, Shantou Ultrasonic, and Epass. These companies showcased advancements in PCB manufacturing, equipment, and materials, highlighting China's growing influence in the global electronic circuit industry.
Exhibition Scale and Highlights
JPCA Show 2025 featured 442 exhibitors occupying 1,197 booths, covering an exhibition area of 37,370 square meters. The event attracted a diverse range of participants from Japan and overseas, reflecting the exhibition's international appeal.
Key highlights included:
● DuPont: DuPont presented its advanced interconnect solutions at the exhibition, addressing areas such as fine-line circuitry, signal integrity, power, and thermal management — all critical for AI and high-performance computing applications. Its product portfolio includes IC substrates, advanced PCBs, and packaging technologies, aimed at accelerating product development and improving production efficiency.
● TOPPAN: TOPPAN exhibited Flip Chip-Ball Grid Array (FC-BGA) substrates — high-density semiconductor packaging substrates suited for generative AI and communication devices. The company also introduced next-generation semiconductor packaging technologies, featuring advanced components made from glass and organic materials designed to handle the increasing complexity of LSI data processing driven by AI.
● Nidec: Nidec unveiled its inspection technologies for glass panel TGVs and its new EFEM (Equipment Front End Module), along with the GATS-8360 — an innovative sensor-based insulation inspection system. These solutions cater to the growing inspection needs of AI and low-earth-orbit satellite PCB manufacturing, offering enhanced precision in optical and electrical inspection systems.
● PEMTRON: PEMTRON introduced its POSEIDON wafer warpage measurement system and the JUPITER 3D X-ray Inspection System (AXI), both designed to enhance quality control and precision in semiconductor and electronics manufacturing.
Concurrent Forums and Seminars
The exhibition hosted several concurrent events, including:
● Keynote Forum on Total Solutions for Electronic Equipment: Discussed comprehensive approaches to electronic equipment development and integration.
● 2025 Advanced Mounting Technology Seminar: Explored the latest trends and innovations in mounting technologies.
● JISSO PROTEC 2025: Focused on automation and advanced assembly technologies.
● JIEP Academic Conference: Provided a platform for academic and industry experts to exchange insights on electronic packaging and circuit technologies.
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